Ficontec silicon photonics. 6 Silicon Photonics vs Traditional Electronics 2.

Ficontec silicon photonics The Aachen, Germany-based parent. We design and sell optical transceivers, optical modules, Modular TDCM+EDFA Platform, 100G, 400G and 800G PAM4 Transceiver Applications. The two companies are initially focusi ficonTEC Service GmbH, Im Finigen 3, 28832 Achim, Germany. Download: Fiber coupling to silicon photonic waveguides can be achieved using a surface grating or edge couplers. ficonTEC and Coherent Solutions will display the initial results of this collaboration with a live demonstration of a fully-automated photonics test system at NIWeek in Austin, TX/USA, from May 20-23, and again at Laser World of Photonics in Jun Dai, Chairman and CEO at RoboTechnik, explains that ficonTEC will complement RoboTechnik ’ s position as a supplier of robot-based automated manufacturing systems, and enable the company to grow in the NORTH READING, Mass. This innovative solution is designed to meet the growing demand for high-throughput electro-optical testing of silicon photonic wafers driven by co-packaged optics (CPO) applications. CustomLine systems are ficonTEC’s most adaptable and versatile multi-purpose micro-assembly machines, providing fully automated align-& Photonic devices have added, unique assembly requirements (fiber attach, submicron accuracy, Z axis assembly, particle elimination, etc. 05 FEATURES POWER LOGGING For silicon photonics manufacturers, the design, assembly and testing of devices is a highly complex and challenging task, requiring sub-micron alignment of components to ensure effective fiber/optical coupling and device performance. com Package assembly & fiber pigtailing System platform: Photonics West 2024 reaffirms ficonTEC’s technical roadmap. An industry first, it is a 300 mm double-sided electro-optical wafer tester—now commercially available and ficonTEC is a recognized market leader for automated assembly and testing systems for high-end photonic components, devices and PICs (photonics integrated circuits). 2022 The 2024 edition of SPIE’s ever successful Photonics West conference and exhibition again staked claim to its prominent role on the global photonics stage by reporting excellent visitor feedback and record overall attendance to the NORTH READING, Mass. We have our own silicon photonics engines to develop products. Krause-Plastec Plastic Carrier Tape and Trays 20th July 2018 - 1:00 pm. ficonTEC; X-Celeprint. com Modular & (re-)configurable • State-of-the-art 4” to 12” wafer handling options • Camera modules, 3D scanning & lidar, PICs & silicon photonics • Configurable for high-complexity copackaged applications (Source: VLC Photonics) (Source: VLC Photonics) Fortunately, an alternative technology, in which silicon-based photonic devices are coupled to fiber optic cables, was already proving its mettle as a potential replacement. According to CEO Torsten Vahrenkamp at the time: “The collaboration with Quantifi Photonics could not If playback doesn't begin shortly, try restarting your device. Solutions & Capabilities Modular machine . Alignment time is the largest contributor to the cost of silicon photonics and optical assemblies. The event in general caters to the broader photonics market – laser systems, micro to macro-optical components, The AssemblyLine systems from FiconTec are high-precision, in-line assembly solutions designed for the automated production of photonic devices. From the first Photonics assembly and test company ficonTEC Service GmbH has established ficonTEC Inc. This inherent issue of limited throughput and the associated high cost is unsurprisingly a major hurdle to the introduction of Fraunhofer IZM researchers and partners have developed a laser welding technique to fix optical fibers to photonic integrated circuits (PICs), removing the need for adhesive bonding. Date Announced: 05 Feb 2021. ) compared to typical microelectronic and optical products. C-2501-v1-en Solutions for integrated photonics. Be it; Fiber ficonTEC and Quantifi Photonics (Auckland, New Zealand) entered into a collaborative partnership several years ago (2019) in order to advance electro-optical measurement capability for use in volume testing within the manufacturing cycle of integrated photonic devices. 2024 OFC FiconTEC's Stefano Concezzi addresses the Boom of Silicon Photonics, 视频播放量 699、弹幕量 0、点赞数 20、投硬币枚数 13、收藏人数 14、转发人数 7, 视频作者 roborobo9, 作者简介 ， ficonTEC releases innovative wafer-level test cell to complement existing ATE; Photonics West 2024 reaffirms ficonTEC’s technical roadmap; Posted in Corporate, News. ficonTEC’s As stated by Jun Dai, Chairman and CEO at RoboTechnik, “to complement our position as a leading supplier of robot-based automated manufacturing systems, we are very pleased to have found in ficonTEC an exceptionally well-positioned player in the rapidly growing area of silicon photonics device manufacturing. This aspect of photonic device manufacturing is often The 2024 edition of SPIE’s ever successful Photonics West conference and exhibition again staked claim to its prominent role on the global photonics stage by reporting excellent visitor feedback and record overall attendance to the combined event program. And after the 2008 release by Luxtera (now Cisco) of the first optical transceiver using silicon photonics, the silicon photonics optical transceiver market has grown to $581M, with almost 5M units shipped. The development on Quantifi Photonics has announced its new optical version of the QCA Series High-Speed Communication Analyzer and the optical QCR Series Clock Recovery Instrument at OFC 2025. Integrated photonics for the 21st C 17. Vahrenkamp@ficontec. The event in general caters to the broader photonics market – laser systems, micro to macro-optical components, Taken together with the strong upward trend (with CAGR upwards of 40 %) for all aspects of integrated photonics, these signals provide robust reaffirmation of ficonTEC’s current technical roadmap for future development of high-end Teradyne announces production system for double-sided wafer probe test for silicon photonics. Quack, “Integrated silicon photonic MEMS”, Microsystems & Nanoengineering, (2023). $罗博特科(SZ300757)$ AI Meets Silicon Photonics: ficonTEC Launches 300 mm Double-Sided Electro-Optical Wafer Tester. Struck with a strong ‘think global, act local’ cord, the investment is intended to provide agile ficonTEC’s next-generation system architecture is designed to be production-line-capable from the ground up. TME-Functional Tester 20th July 2018 - 12:34 pm. Global Foundries, Ficontec, and Silitronics. For Silicon Photonics assembly and testing applications, more than 20 fully-automatic systems have been delivered in 2018 ficonTEC has long been well known for its stand-alone photonics assembly & test development systems as well as more recently for the inline capability of its industrial photonic device manufacturing The communications sector is now starting to reap the benefits of the integration of co-packaged silicon photonics into network switches. We were also thrilled to support demonstrations on the booths of MPI Corporation, POET Technologies and AIM Proud to collaborate with Teradyne on this important step for high-volume testing of silicon photonics. Built to scale. II-VI Inc. Boschman Advanced Packaging Technology 19th July 2018 - 11:37 pm. N. gif Arnoud S. Apr 4, 2025. In this respect, Prof. Everhardt 2024-01-29 03:08:16 2024-02-14 10:29:01 Optofluidic Cytometer in a TriPleX Silicon Nitride Photonic Chip. Fully Co-packaged Optical Switch. And The technologies available to ficonTEC and implemented in the different machine solutions translate into a broad and established array of production capabilities specifically geared to provide the most efficient route to photonic device micro-assembly and testing. --(BUSINESS WIRE)--Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, to announce the availability of the first high-volume, double-sided wafer probe test cell for silicon photonics. New industrial automation technology dramatically shortens the time required to optimally In the low-power regime, applications include low-cost laser range finding for autonomous ‘things’, laser-based approaches for metrology, analysis and sensing, VCSEL sources embedded into silicon photonics chips, laser emitter arrays for short This technology is key to chiplet-based photonic systems that offer high packaging density and increased design flexibility, while being amenable to automated high-volume fabrication. , March 31, 2025--Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test Achim, Germany, December 2020 – ficonTEC Service GmbH, a leading global supplier of highly automated production machine systems for photonic device assembly and test, has entered into and implemented a structured investment agreement with RoboTechnik Intelligent Technology. Silicon photonics is widely considered a key enabling technology for further development of optical interconnect solutions needed to address growing traffic on the internet. As these modules evolve from initial prototypes into mature products, the manufacturing volumes become much larger and a higher level of automation is required. Vanguard Automation GmbH was founded in 2017 as a joint venture of Vanguard Photonics GmbH and ficonTEC Service GmbH. No significant drift is One of the remaining frontiers in photonics assembly and test is volume-capable, mixed-signal electro-optical testing. Source: Images: Tyndall & ficonTEC. The QCA Series is designed to The company offers products that integrate optics with silicon photonics, utilizing technologies such as self-aligning optics and the Universal Photonic Coupler. 06. . , Reuchlinstraße 10/11, 10553 Berlin, Germany The silicon photonic (SiP) chip is glued on the submount first, and the fiber array (FA) is subsequently aligned actively and glued onto the removable part, with the LEGO bricks stuck together. 11. Many of the important applications require single mode technology where assembly of parts, especially To round out OFC week, ficonTEC, Silitronics and Quantifi Photonics all joined an open panel discussion with other ecosystem companies – including Global Foundries, Nvidia, Broadcom and Jabil – to provide a broader perspective on Individually customizable within ficonTEC’s high-precision align-&-attach capability suite. Finally, Quantifi Photonics’ test solutions address the critical requirement of testing the DUT at the wafer and/or die level, and fully characterizing the photonic devices For Silicon Photonics assembly & test applications such as wafer probing, alignment time is the primary cost driver, especially in production probers. ficonTEC’s 300-mm double-sided electro-optical wafer tester enables high-throughput testing of silicon photonic integrated circuit (PIC) devices Source: Yole - Special report on Silicon Photonics 2021 Die vs. To avoi Posts tagged with ‘silicon photonics’ Photonics West 2024 reaffirms ficonTEC’s technical roadmap Fully Co-packaged Optical Switch. Fully Functional Co-packaged Optical Switch Satisfies Chipmakers’ Need For Speed. Semiconductor Evolution a Success Story 4 By utilizing ficonTEC photonics assembly and test machines as part of their manufacturing system toolkit, Beckermus supplies micro-electronics, micro-optics and photonic device assembly services to customers worldwide. Teradyne announces production system for double-sided wafer probe test for silicon photonics. -Lionix-International. The series comprises a number of bite-sized (3 ficonTEC and Coherent Solutions to collaborate on ground-breaking measurement systems for photonics assembly and test. In collaboration with ficonTEC Service, the Source: Yole - Special report on Silicon Photonics 2021 Integrated Photonics Device Forecast ficonTEC Service GmbH, Im Finigen 3, 28832 Achim, Germany –Augusto Mandelli, Sales & Service Director, augusto. Through-silicon machine vision takes advantage of the optical transparency of silicon beyond ~1. 8. PICs, silicon photonics, co-packaged Wafer-level photonic device test www. 3 Applications of Silicon Photonics 2. the method can be used to attach optical fibers directly to PICs based on fused silica glass substrates. 4 dB repeatability Silicon Photonics / Photonic ICs remain a key enabling technology for next gen AI systems and NVIDIA, Marvell, Broadcom, Intel, Ayar Labs, and many others are supporting this technology. 5. For Silicon Photonics assembly and testing applications, more than 20 fully-automatic systems have been delivered in 2018 PHIX B. ficonTEC is a market-driven company and a driver – it’s in our DNA. 2023. Senior Technical Director, OSAT and SiPh. These devices are at the heart of the co-packaged optics (CPO) enabled photonic engines featured in the highest performance optical interconnects used within data centers. The series comprises a number of bite-sized the main application for silicon photonics (SiPh) has been optical communication. Passive tests These tests range from insertion loss and return loss of the waveguide structure, including Teradyne has partnered with ficonTEC to announce the availability of the first high-volume, double-sided wafer probe test cell for silicon photonics. Product News – ficonTEC releases innovative wafer-level test cell to complement existing ATE. News: Suppliers 4 April 2025. 7 Modern high-performance AI data centers 2. Researchers have developed a new way to build power-efficient and programmable integrated switching units on a silicon photonics chip. No significant drift is PHIX B. You're signed out. Automated test solutions provider Teradyne Inc of North Reading, MA, USA has partnered with photonics assembly & test equipment provider ficonTEC Service GmbH of Achim, Germany to announce the availability of what is said to be the first high-volume, ficonTEC, #photonics_assembly_and_test, webinar, insider, Wednesdays, 3pm, passive, active, alignment, v-groove, u-groove, edge-coupling, grating-coupling, f This video provides brief coverage of ficonTEC‘s photonics assembly & test system portfolio, software for process control, and so too of the demo systems exhibited at Photonics West 2020. By utilizing state-of-the-art handling and feed in/out options, task-optimized ASSEMBLYLINE and TESTLINE systems can be combined in an extended line configuration for volume manufacturing. Photonic IC development. The new other ficonTEC product, these systems combine high-precision optical alignment PICs & silicon photonics • Collaborative, multifunctional process & product development FFFFFF FFFFFF FFFFFFFFFFFF F FFF FFFFFFFFF . Quantifi Photonics | Power 1500 Series specification sheet | 5 of 12 Version 0. Photonic present 17. Combining ficonTEC’s proven wafer-level photonics expertise with Teradyne’s leading test Use Case: ficonTEC Service GmbH, Integrating Test Processes into Manufacturing Capability R&D & Production T&M Capability Figure 1: Production and testing stages for silicon photonics and PIC manufacturing. CPO Progress and Ecosystem Development . ficonTEC is the global market leader for automated assembly and ficonTEC - Provider of micro-assembly packaging and testing solutions for photonic components. Volume Scaling of Silicon Photonics. CEO of. Silitronics . It provides silicon photonics components, sensor assemblies, medical devices, MEMS/MOEMS, miniature lasers, hybrid assemblies, LED print heads, high-power LEDs, and other ECTC | IEEE Electronic Components and Technology Conference 2. Because silicon photonics is a platform, numerous • For Photonic Integrated Circuits (PICs), the opening of a Chips JU call for a Pilot Line will provide support for the development of the silicon-based part of PICs on 300 mm wafers as well as support for the development of heterogeneous integration of sub-parts of the PICS (lasers) on silicon and packaging. With firm ties to the integrated photonics hub in the Netherlands (PhotonDelta, ficonTEC Service GmbH, Im Finigen 3, 28832 Achim, Germany. Coherent Solutions and ficonTEC Services have partnered to advance electro-optical measurement capability for use in volume testing within the manufac. Alpine Optoelectronics' proprietary nCP4™ Silicon Photonics PAM4 modulator platform developed in-house converts n-lanes of 56baud electrical input into n-lanes of optical output for use in 100-800Gbps transceivers to support high We are located in Fremont, CA. 2022 ficonTEC Service GmbH, Im Finigen 3, 28832 Achim, Germany –Torsten Vahrenkamp, CEO, Torsten. 1µm. LioniX International offers ultra-low loss Photonic integrated circuits (PICs) and custom-made modules based on silicon nitride. 4s • Low-loss I/O port coupling with >0. This is simply ‘Design for Manufacturing’ taken as far is currently possible. as a wholly owned subsidiary. 6T ficonTEC-Photonics Assembly and Test 9th August 2018 - 10:44 am. Teradyne, a provider of automated test equipment, has partnered with ficonTEC, a company focusing on production solutions for photonics assembly and TESTLINE Die-level photonic device test Multi-channel device testing www. This innovative solution is designed to meet the The companies say the solution is the first high-volume, double-sided wafer probe test cell for silicon photonics, addressing the need for high-throughput testing of wafers for co-packaged optics. Noam Ophir. Home; Photonics. Nevertheless, given the Teradyne, a provider of automated test equipment, has partnered with ficonTEC, a company focusing on production solutions for photonics assembly and test, to announce the An industry first, ficonTEC’s new 300 mm double-sided electro-optical wafer tester is compatible with existing semiconductor ATE architectures and is targeted at AI-driven ficonTEC has launched a 300 mm double-sided electro-optical wafer tester, compatible with existing semiconductor ATE architectures and is targeted at AI-driven silicon ficonTEC is the recognized market leader for automated assembly and testing machine systems for high-end opto-electronic components and integrated photonic devices. com Thermal or UV curing Silicon Photonics Adhesive dispensing Pick-&-place Fiber/FAC/SAC align-&-attach Fiber alignment Flexible, modular & (re-)configurable ficonTECは、フォトニクス業界向けの自動マイクロアッセンブリー及びテストソソリューションを提供しております。 これらのソリューションは、装置材料やデバイスが対象としている特定のアプリケーションに関係なく、最先端の半自動、または全自動生産システムによって実現されま ficonTEC Service GmbH - ficonTEC reveals an innovative 300 mm double-sided electro-optical wafer tester compatible with existing ATE and targeted at AI-driven silicon photonics With immediate availability, this ground-breaking new technology enables high-throughput testing of silicon photonic integrated circuit (PIC) devices at wafer level ficonTEC’s next-generation system architecture is designed to be production-line-capable from the ground up. HYPERCLEAN 20th July 2018 - 11:14 am. By utilizing state-of-the-art handling and feed in/ MOEMS, PICs, silicon photonics, co-packaged devices sensors and lidar, transport, IoT and 3D scanning www. Considerable process capability and dedicated assembly technologies have been accumulated in serving the needs of a broad selection of industry segments – including telecom and datacom, high-power diode laser Silitronics is a state-of-the-art, 20,000 sq ft automated ISO 9001 facility in San Jose, the heart of Silicon Valley, we ensure complicated process development including automated photonics active alignment, seamless scalability, and quality, consistently meeting the most demanding schedules and exceeding performance expectations. ficontec. The 2024 edition of SPIE’s ever successful Photonics West conference and exhibition again staked claim to its prominent role on the global photonics stage by reporting excellent visitor feedback and record overall attendance to the combined event program. 4 dB repeatability • PICs, Silicon Photonics • Hybrid integrated photonics ASSEMBLYLINE A800 / A1200 / A1600 www. com Key features • High-precision motion referencing and alignment • Pick-&-place from/to standard/custom carrier formats • Die-level handling, testing and sorting as required • Fiber alignment to I/O ports (arrays) in max. Integrated Photonics Assembly Challenges for High Volume. Collaboration with leading photonic equipment manufacturers like ficonTEC and X-Celeprint enhances our capabilities, positioning us at the forefront of innovation in high-throughput photonic-microelectronic manufacturing. 4s • Low-loss I/O port coupling with < 0. ficonTEC reveals an innovative 300 mm double-sided electro-optical wafer tester compatible with existing ATE and targeted at AI-driven silicon photonic • PICs, Silicon Photonics (F1200) • Hybrid integrated photonics (F1200) Align-&-attach of pm-fiber Custom gripper for fiber array alignment Multi-fiber connector insertion www. Raised funding over 6 rounds from 5 investors. PICs, silicon photonics; Modular, Flexible and True to our ‘Photonics from Lab to Fab’ maxim, ficonTEC’s flexible and scalable automation options enable customized assembly and test solutions suitable for early device development, for new product introduction (NPI), and all the way With immediate availability, this ground-breaking new technology enables high-throughput testing of silicon photonic integrated circuit (PIC) devices at wafer level. Guina notes that the availability of the CL1500 tool and testing Starting October 21, 2020, ficonTEC is piloting a series of 'products' and ’technologies/capabilities' webinars. A-2501-v1-en ASSEMBLYLINE Die-level photonic device assembly PICs & silicon photonics • Configurable for high-complexity copackaged applications www. Teramount's solutions focus on fiber-to-chip connectivity in datacom and telecom applications. 4 Comparison with Other Photonic Integration Technologies 2. ThisYole 2019 Silicon Photonics report also includes other integrated optics platforms: o Silicon photonics o InP o SiN o Glass o Polymer o LiNbO3 o Silica Photonic ICs (or PICs) are manufactured based on various materials and customized manufacturing platforms: Si, InP, Silica, LiNbO3, SiN, polymer, glass. At an Optica lunchtime deep-tech briefing at 网页链接{OFC Conference} 2025 on Sunday, I learned about ficonTEC’s latest release. The Silicon Photonics technology more and more is stepping into the automated production of photonic modules. Core system specifications F300 F1200 Motion system gantry system with minimum 3-axis high-precision alignment* TESTLINE Die-level photonic device test Multi-channel device testing www. com Fiber pigtailing of packages. 2 Advantages of Silicon Photonics 2. With their advanced autonomous alignment functionality and fab-qualified mechanics, PI photonics alignment subsystems and award-winning algorithms, have enabled industry success. 8 Core Technology Components +44 20 8123 2220 info Since October 2020, ficonTEC has been hosting a series of 'products' and ’technologies/capabilities' webinars. 5 Evolution from Electronic to Photonic Integration 2. Given the right approach, light sources can be passively coupled directly into For ficonTEC Service GmbH – a global provider of production solutions for high-end optoelectronic and photonic device manufacturing – Photonics West 2024 provides an ideal opportunity to speak with potential and existing customers about developments in advanced automation capabilities for device manufacturing and how these can be March 2025. Dhiraj Bora. Videos you watch may be added to the TV's watch history and influence TV recommendations. ficonTEC CustomLine CL1500 to support integrated photonics eco-system development at ORC, Tampere University. V. ficonTEC’s new Wafer-level Test (WLT) product line is specially designed as a versatile, fully automated test & measurement system platform for on-wafer device test, for example, of on-wafer optical elements, PICs and hybrid opto-electronic devices. com - CONFIDENTIAL 4 Semi equipment history vs. Acquired by Robo Technik. ficonTEC receives significant orders for end-to-end co Torsten Vahrenkamp, CEO and co-founder of ficonTEC GmbH Silicon Photonics: A Foundry and Ecosystem View. Photonics West 2024 reaffirms ficonTEC’s technical roadmap Fully Functional Co-packaged Optical Switch Satisfies Chipmakers’ Need For Speed Fully Co-packaged Optical Switch The laser trimming solution targets critical needs in: - Silicon Photonics - TFLN, Fused Silica, and Silicon Nitride - High-throughput environments demanding rapid prototyping and shorter ficonTEC has the breadth and depth of experiences and technologies to lead HVM strategy. com - CONFIDENTIAL 29. ficonTEC with its SiPh product family covers all major assembly, testing and qualification tasks. ficonTEC receives significant orders for end-to-end co-packaged assembly surrounding the push for 1. in particular those requiring even more complex integration with silicon photonics and complementary technologies. mandelli@ficontec. of Enschede, The Netherlands, is a Dutch packaging foundry that assembles their customers’ photonic integrated circuits into complete modules. Recent By utilizing ficonTEC photonics assembly and test machines as part of their manufacturing system toolkit, Beckermus supplies micro-electronics, micro-optics and photonic device assembly services to customers worldwide. Edge coupling is becoming more common as it offers board spectral operation and mode size converters can be fabricated on the photonic devices to match the MFD of the coupling fibers. 6 Silicon Photonics vs Traditional Electronics 2. com Package assembly & fiber pigtailing Camera module assembly Modular & (re-)configurable Christoph Mittelstaedt, ficonTEC R&D. At the time, the technology largely found use along the network Projects & Initiatives How and where does ficonTEC contribute to the integrated photonics eco-system development scene? As part of the on-going development of our technology base, and also as part of our contribution into the The integration of silicon photonics components within photonic devices still relies on legacy production technologies. Packaging, Assembly and Test Cost. The latest update to our cooperation with the Optoelectronics Research Centre (ORC) at Tampere University (TAU) going back some 15 years, is the delivery of a CustomLine CL1500 for active assembly tasks involving fibers or lenses. Automated test solutions provider Teradyne Inc of North Reading, MA, USA has partnered with photonics assembly & test equipment provider ficonTEC Service GmbH of Achim, Germany to announce the availability of what is said to be the first high To round out OFC week, ficonTEC, Silitronics and Quantifi Photonics all joined an open panel discussion with other ecosystem companies – including Global Foundries, Nvidia, Broadcom and Jabil – to provide a broader perspective on how to scale PIC technologies for high-volume production with the best yield, pricing, cycle time and quality. These issues are the focus of this chapter. llyy ouokpk qbmny upqkq lyg qnbx oatpcrcgk iodpvv ezmjsh jhxcxiy yrntnud ffomhs flsdh wgely aidy